Introduction

Introduction

The Mixed-Signal IC Design Techniques Training Course provides an in-depth understanding of the design, simulation, and verification of integrated circuits that combine analog and digital functionalities. In today’s data-driven world, mixed-signal ICs power everything from smartphones and IoT devices to medical electronics and automotive systems. Training Course on Mixed-Signal IC Design Techniques is designed to bridge the gap between analog and digital domains, focusing on ADC/DAC design, PLLs, data converters, clock management, and signal conditioning, essential for modern SoC (System-on-Chip) implementations.

Through a balanced mix of theory, practical labs, and real-world case studies, participants will explore key design flows using EDA tools such as Cadence Virtuoso, Spectre, and Verilog-A/M/S, covering layout considerations, verification challenges, and power-performance trade-offs. Engineers and designers will gain hands-on experience in noise analysis, mixed-signal simulation techniques, and layout parasitics, empowering them to develop robust and scalable mixed-signal ICs for emerging technologies such as AI hardware, 5G, automotive radar, and wearable devices.

Programme Curriculum

Training Course on Mixed-Signal IC Design Techniques

Introduction

Course duration

10 Days

Course Objectives

Understand fundamentals of analog and digital signal integration
Design and simulate high-performance ADC and DAC architectures
Implement clocking strategies using PLLs and clock dividers
Optimize mixed-signal layout for noise isolation and parasitics
Model circuits using Verilog-A, Verilog-AMS, and SystemVerilog
Explore analog front-end (AFE) design for sensor interfacing
Perform power and area optimization in SoC integration
Analyze jitter, phase noise, and timing errors in clock circuits
Use Cadence and Spectre tools for schematic to layout simulation
Apply mixed-signal verification methodologies (MSVM)
Implement low-power mixed-signal techniques for portable devices
Develop testbenches for mixed-signal simulation and corner analysis
Examine case studies from audio ICs, biomedical ICs, and RF transceivers

Organizational Benefits

Build internal IC design capabilities for analog/digital integration
Reduce time-to-market for mixed-signal SoC products
Improve IC performance, power efficiency, and reliability
Minimize design iterations with optimized simulation flows
Foster innovation in AI, biomedical, and sensor-based systems
Prepare teams for advanced EDA and verification environments
Enhance cross-functional collaboration in analog/digital co-design
Reduce dependency on third-party design and verification teams
Enable faster IP development for ASIC and custom IC projects
Increase competitiveness in automotive, IoT, and mobile IC markets

Target Participants

Analog and Digital IC Designers
Mixed-Signal SoC Engineers
Electronics Design Engineers
EDA Tool Users and Test Engineers
Embedded Systems Developers
Students and Researchers in Microelectronics
System Architects and RF Designers

Course Outline

Module 1: Introduction to Mixed-Signal Design

Differences between analog, digital, and mixed-signal domains
Key applications in SoC and embedded systems
Basic design flow and toolsets
Challenges in mixed-signal integration
Case Study: Mixed-signal IC in wearable fitness trackers

Module 2: Analog and Digital Fundamentals

Analog signal processing basics
Digital logic and timing principles
Mixed-signal signal flow and integrity
Common analog/digital interface techniques
Case Study: Analog front-end for biosensors

Module 3: Data Converter Design (ADC/DAC)

Nyquist-rate and oversampling ADCs
DAC architectures: R-2R, current-steering
Key performance metrics: INL, DNL, SNR
Clock jitter and sampling errors
Case Study: 12-bit SAR ADC in smart sensors

Module 4: Phase-Locked Loops and Clocking

Basics of PLL, VCO, and divider circuits
Phase noise and jitter analysis
Clock distribution and skew mitigation
Clock domain crossing (CDC) challenges
Case Study: PLL in 5G baseband ICs

Module 5: Noise and Interference in Mixed-Signal Circuits

Thermal, flicker, and quantization noise
Crosstalk and substrate coupling
Isolation techniques in layout and packaging
Impact of noise on data converters
Case Study: Audio codec IC in smartphones

Module 6: Power Management and Regulation

LDOs and switching regulators for mixed-signal blocks
Power gating and dynamic voltage scaling
Ground bounce and supply integrity
Low-noise design considerations
Case Study: PMIC design for wearable SoCs

Module 7: Simulation Tools and Modeling

Behavioral modeling with Verilog-A and AMS
Spectre and ADE usage for AC, DC, and transient analysis
Monte Carlo and corner simulations
Mixed-signal simulation flow and testbenches
Case Study: Verilog-A model for sensor interface

Module 8: Layout and Parasitic Extraction

Floorplanning for analog-digital co-design
Parasitic-aware layout and LVS/DRC checks
Matching techniques and layout symmetry
Guard rings and deep n-well implementation
Case Study: Layout optimization of SAR ADC

Module 9: Mixed-Signal IP Integration

IP reuse and integration in SoC environment
Interface protocols: I2C, SPI, UART
Static timing analysis and setup/hold violations
Voltage domain crossing and isolation
Case Study: AFE integration in bio-signal processor

Module 10: Low-Power Design Techniques

Sleep modes and clock gating
Energy-efficient ADC/DAC design
Leakage minimization in analog blocks
Battery-powered circuit design
Case Study: Mixed-signal IC for hearing aids

Module 11: Mixed-Signal Verification Strategies

Functional and behavioral verification
Analog assertions and checkers
AMS testbenches and waveform analysis
Co-simulation with digital RTL
Case Study: Mixed-signal verification of PLL loop

Module 12: Sensor Interface and Analog Front-End (AFE)

Instrumentation amplifiers and filters
Capacitive, resistive, and piezoelectric sensor interfacing
Low-noise amplifier (LNA) design
Calibration and linearization techniques
Case Study: ECG analog front-end IC

Module 13: RF and High-Speed Mixed-Signal Interfaces

RF front-end integration techniques
Impedance matching and S-parameter analysis
High-speed SerDes and transceivers
Jitter tolerance and eye diagram analysis
Case Study: RF transceiver in BLE chip

Module 14: Testability and DFT for Mixed-Signal Circuits

Built-in self-test (BIST) techniques
Loopback testing for ADC/DAC
Parametric testing of analog blocks
DFT strategies for analog-digital interfaces
Case Study: BIST in automotive mixed-signal SoC

Module 15: Future Trends in Mixed-Signal IC Design

AI-driven design automation tools
3D ICs and heterogeneous integration
Neuromorphic mixed-signal circuits
Design challenges in 6G and radar systems
Case Study: Edge-AI mixed-signal IC in robotics

Training Methodology

This course employs a participatory and hands-on approach to ensure practical learning, including:

Interactive lectures and presentations.
Group discussions and brainstorming sessions.
Hands-on exercises using real-world datasets.
Role-playing and scenario-based simulations.
Analysis of case studies to bridge theory and practice.
Peer-to-peer learning and networking.
Expert-led Q&A sessions.
Continuous feedback and personalized guidance.

Register as a group from 3 participants for a Discount

Send us an email: info@fineskilltrainingcenter.org or call +254769199797

Certification

Upon successful completion of this training, participants will be issued with a globally- recognized certificate.

Tailor-Made Course

We also offer tailor-made courses based on your needs.

Key Notes

a. The participant must be conversant with English.

b. Upon completion of training the participant will be issued with an Authorized Training Certificate

c. Course duration is flexible and the contents can be modified to fit any number of days.

d. The course fee includes facilitation training materials, 2 coffee breaks, buffet lunch and A Certificate upon successful completion of Training.

e. One-year post-training support Consultation and Coaching provided after the course.

f. Payment should be done at least a week before commence of the training, to Fineskill Training Center account, as indicated in the invoice so as to enable us prepare better for you.

Skills & Software Covered

Mixed-Signal Design IC VLSI Electronics

Programme Fee

Duration: 10 Days

Method: Online or Physical

Online Price: $2,000

Physical Price: $3,000

Certification: Accredited Certificate

View Available Dates 📄 Download Course Outline (PDF)

Available Sessions

Location

Month

Year

Oct 19 2026

19 Oct — 30 Oct 2026

💻 Online / Virtual session

Online $2,000